Intel

Ahead of a potential IPO, Anthropic reported an $80.7 billion first-half net loss. A $72 billion revaluation of convertible instruments accounts for most of the figure, while compute and infrastructure spending approached $9 billion.

Tesla and SpaceX are evaluating a potential combination that could bring Starlink, AI infrastructure, chip development, robotics, electric vehicles, and space transportation under one company. No deal terms have been agreed, and a transaction is not assured.

Lenovo’s January 6 CES 2027 event will put its new Human + AI strategy in the spotlight, with a focus on connected personal devices, enterprise technology, and cloud infrastructure. The company has not yet detailed any new hardware.

Intel CEO Lip-Bu Tan says the company’s internal restructuring is about 80% complete. A planned Intel-NVIDIA PC chip partnership is one of the consumer-facing developments to watch, while Intel Foundry’s effort to compete in contract manufacturing will take considerably longer.

Apple CEO John Ternus says the company is evaluating memory-supply alternatives amid a broader component shortage. In the same interview, he discussed the iPhone Duo’s complex foldable design and Apple’s approach to Gemini-assisted Siri.

A claim from Ice Universe points to a potentially substantial One UI redesign arriving with Samsung’s Galaxy Z Fold9 in 2027, though Samsung has not confirmed the software, device, or its features.

LG has outlined seven Apple Home accessories launching first in the U.S. and Canada, including cameras, a video doorbell, a UWB smart lock, a thermostat, and a room sensor. Prices start at $39.95, with initial sales beginning in December for select products.

ASUS has introduced the 14-inch ExpertBook A7, an ultrathin business laptop with a 3K OLED display, Intel Core 7 processors, a 65Wh battery, and enterprise-focused security features. U.S. pricing and availability have not been announced.

Reported price increases from Qualcomm and Intel could raise component costs for upcoming PCs, including Snapdragon-powered laptops. AMD may make similar changes, but its plans and figures remain unclear.

HP’s ZBook Ultra G3a 16 pairs AMD’s Ryzen AI Max+ PRO platform with up to 192GB of unified memory, aiming to make unusually large local AI workloads practical in a portable workstation.